| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for economically and simply forming fine wiring. SOLUTION: A method is provided for economically and simply forming fine wiring by alleviating the spread of ink, and for forming the wiring with excellent electric conductivity by having even height of the formed ink. Further, a conductive board is provided with excellent high-dense electric conductivity including fine wiring. This method for forming the fine wiring comprises a step of (a) treating at least one side of a wiring pattern to be formed on a base substrate with alkali metal hydroxide solution, and (b) treating hydrophobic ink in accordance to the wiring pattern to be formed. COPYRIGHT: (C)2007,JPO&INPIT
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