发明名称 METAL FOIL WITH RESIN AND METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a metal clad-laminate or a resin-coated metal foil in which tight adhesion and smoothness of a surface between an insulating resin composition layer and a metal foil are attained in combination and practical factors such as economical efficiency and handling easiness upon production of a printed wiring board can also be attained and further to provide a printed wiring board and its production method using the metal-clad laminate and the resin-coated metal foil, in which reliability and a circuit formability are excellent and a conductive loss is remarkably low. SOLUTION: In a resin-coated foil comprising an insulating resin composition layer and a metal foil tightly adhered to one or both surfaces of the insulating resin composition layer, at least the side of the insulating resin composition layer is subjected to a surface treatment and the both surfaces of the metal foil are substantially not subjected to roughening-treatment. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007022091(A) 申请公布日期 2007.02.01
申请号 JP20060251671 申请日期 2006.09.15
申请人 HITACHI CHEM CO LTD 发明人 TAKAI KENJI;SUEYOSHI TAKAYUKI
分类号 B32B15/08;H05K1/09;H05K3/06;H05K3/38 主分类号 B32B15/08
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