发明名称 |
METAL FOIL WITH RESIN AND METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal clad-laminate or a resin-coated metal foil in which tight adhesion and smoothness of a surface between an insulating resin composition layer and a metal foil are attained in combination and practical factors such as economical efficiency and handling easiness upon production of a printed wiring board can also be attained and further to provide a printed wiring board and its production method using the metal-clad laminate and the resin-coated metal foil, in which reliability and a circuit formability are excellent and a conductive loss is remarkably low. SOLUTION: In a resin-coated foil comprising an insulating resin composition layer and a metal foil tightly adhered to one or both surfaces of the insulating resin composition layer, at least the side of the insulating resin composition layer is subjected to a surface treatment and the both surfaces of the metal foil are substantially not subjected to roughening-treatment. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007022091(A) |
申请公布日期 |
2007.02.01 |
申请号 |
JP20060251671 |
申请日期 |
2006.09.15 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TAKAI KENJI;SUEYOSHI TAKAYUKI |
分类号 |
B32B15/08;H05K1/09;H05K3/06;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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