| 摘要 |
A resistance bonding method comprises contacting a plurality of bonding members, which are electro-conductive, supplying current to the bonding members under a stress applied to a contact interface therebetween by means of plural electrodes in contact with the bonding members thereby to bond the members. The current supply is conducted by switching energizing paths. Part of the members is thermally expanded by current supply before one of the bonding members is contacted with other member, and the members in contact with each other are bonded by the second current supply.
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