发明名称 INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS
摘要 An integrated liquid cooling system ( 100 ) includes a pump ( 10 ), a mounting base ( 15 ), a heat dissipating member ( 20 ). The mounting base defines therein a through hole ( 151 ). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
申请公布号 US2007023167(A1) 申请公布日期 2007.02.01
申请号 US20060308275 申请日期 2006.03.15
申请人 LIU TAY-JIAN;YANG CHIH-HAO;TUNG CHAO-NIEN;HOU CHUEN-SHU 发明人 LIU TAY-JIAN;YANG CHIH-HAO;TUNG CHAO-NIEN;HOU CHUEN-SHU
分类号 H05K7/20 主分类号 H05K7/20
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