SPUTTERING TARGET, METHOD FOR PRODUCING SAME, SPUTTERING THIN FILM FORMED BY USING SUCH SPUTTERING TARGET, AND ORGANIC EL DEVICE USING SUCH THIN FILM

摘要

Disclosed is a sputtering target which enables to provide a sputtering film with high moisture barrier properties and high flexibility. This sputtering target also secures high film-forming rate while reducing damages to an object on which the film is formed during the sputtering. In order to realize such a sputtering target, a powder mixture containing, in a weight ratio, 20-80% of an SiO powder and the balance of TiO₂ powder and/or a Ti powder is subjected to pressure sintering. The sintered body has a composition expressed as SiaTißO? (wherein a, ß and ? represent respective molar ratios of Si, Ti and O), and a/ß satisfies 0.45-7.25 while ?/(a + ß) satisfies 0.80-1.70.