| 发明名称 |
System and method for direct-bonding of substrates |
| 摘要 |
A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
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| 申请公布号 |
US2007026559(A1) |
申请公布日期 |
2007.02.01 |
| 申请号 |
US20050192377 |
申请日期 |
2005.07.29 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
HALUZAK CHARLES C.;PIEHL ARTHUR;CHEN CHIEN-HUA;SHIH JENNIFER |
| 分类号 |
H01L21/00;H01L21/30 |
主分类号 |
H01L21/00 |
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