发明名称 |
POLISHING COMPOSITION AND POLISHING METHOD |
摘要 |
The present invention aims to provide a polishing composition which allows high-speed polishing of a barrier film and an inter-layer dielectric film along with a wiring metal at the same time, while preventing dishing and erosion, and particularly maintaining the flatness of metal film. The chemical-mechanical polishing composition of the present invention comprises a dicarboxylic acid having 7 to 13 carbon atoms, an oxidizing agent, an abrasive and water. |
申请公布号 |
WO2006078074(A3) |
申请公布日期 |
2007.02.01 |
申请号 |
WO2006JP301382 |
申请日期 |
2006.01.24 |
申请人 |
SHOWA DENKO K.K.;NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO |
发明人 |
NISHIOKA, AYAKO;ITOH, YUJI;SHIMAZU, YOSHITOMO |
分类号 |
C09K3/14;B24B37/00;C09G1/02;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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