METHOD FOR MANUFACTURING A MICRO HOLLOW TUBE STRUCTURE WITH HIGH ASPECT RATIO USING A LOCALIZED ELECTROCHEMICAL DEPOSITION

摘要

A method for fabricating a metal micro tube with a high aspect ratio using a local electrochemical plating method is provided to fabricate a structure of a copper micro tube having a high aspect ratio at a velocity of 200 micrometer/second by analyzing a growth mechanism of a structure by a local electrochemical plating method using real-time microradiography. A conductive electrode having a fine electrode(30) and a conductive substrate(20) are supplied to a receptacle having an electrochemical medium. An initial position of the fine electrode is set between the surface of the conductive substrate and the lower part of the fine electrode in a manner that the conductive substrate is adjacent to the fine electrode, but the conductive substrate is separated from the fine electrode. An electrical potential greater than a critical voltage is applied to a gap between the fine electrode and the conductive substrate, crossing the electrochemical medium. The fine electrode is transferred to make the lower part of the fine electrode and the upper part of the metal micro tube maintain a distance not greater than a critical distance that corresponds to a location where the metal micro tube is transformed from a porous structure to a densified structure. The critical voltage is a voltage applied when a big difference of an electric field between the corner and the center of the fine electrode is made and the corner of the fine electrode having a strong electric field is plated to form a tube-type structure.