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发明名称
A flux dotting method in Ball Attach procedure of BGA packaging in semiconductor industry
摘要
申请公布号
KR100676654(B1)
申请公布日期
2007.02.01
申请号
KR20050055086
申请日期
2005.06.24
申请人
发明人
分类号
H01L23/48
主分类号
H01L23/48
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代理人
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