发明名称 STRUCTURE OF HIGH-FREQUENCY MICROMACHINE SWITCH, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a micromachine switch that can be manufactured easily with improved yields, and can reduce voltage required for operating the switch, and to provide a manufacturing method of the micromachine switch. <P>SOLUTION: The manufacturing method of the micromachine switch comprises a first switch for forming a signal line conductor 14 for propagating high-frequency signals on a substrate 12; a second step for forming a sacrifice layer on the substrate 12 and the signal line conductor 14; a third step for forming a lower electrode layer, a piezoelectric substrate layer, and an upper electrode layer on the sacrifice layer; and a fourth step for forming a beam section 32 in which one end or both ends are supported by the substrate 12 and a piezoelectric body is sandwiched between the lower and upper electrodes by removing one portion of the upper electrode layer, the piezoelectric substrate layer, and the lower electrode layer, and one portion or entire portion of the sacrifice layer. The beam section 32 is extended while being bent when viewed from a direction vertical to the substrate 12. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007026804(A) 申请公布日期 2007.02.01
申请号 JP20050205391 申请日期 2005.07.14
申请人 KYOTO UNIV 发明人 JINNO ISAKU;KODERA HIDETOSHI;SUZUKI TAKAAKI
分类号 H01H57/00;B81B3/00;H01H49/00;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/29;H01L41/332 主分类号 H01H57/00
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