| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method of electronic parts which can suppress occurring of misregistration of electronic parts with low cost and short processing time. SOLUTION: A printed circuit board 10 is prepared in which a circuit pattern is formed in the front surface, a packaging position mark 43 and printing portions 41, 42 for soldering on the lands 21, 22 are printed using a mask for solder printing, an electronic part 50 is mounted in a position corresponding to the printing portions 41, 42 for soldering on the basis of the packaging position mark 43, and it is subjected to the reflow processing. COPYRIGHT: (C)2007,JPO&INPIT
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