| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device capable of realizing reduction of a manufacturing cost of the socket while securing durability of a contact terminal as well as forming the shortest signal route. SOLUTION: At the tip part of a movable piece part 22B incontact with a terminal part of the semiconductor device DV, a contact part 22b linearly formed nearly parallel to a fixed part 22C is formed. Like this, since the base end of the movable piece part 22B is integrally formed at a position near a part in which a fixed terminal part 22Fa is coupled to the fixed part 22C, the shortest signal route between a solder through-hole of a printed circuit board PB and a contact part 22'b is formed, and therefore its inductance is reduced, and as a result, high frequency band characteristics are improved. Even if a bending moment repeatedly acts on the fixed terminal part 22Fa side, there is no possibility of deviation from the normal initial position at the contact part 22b, and durability of the contact terminal 22'ai is to be secured. COPYRIGHT: (C)2007,JPO&INPIT
|
