| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless copper plating film having excellent adhesiveness to a substrate. SOLUTION: A plating method comprises (1) a coupling step of coupling a silane coupling agent 12 to a surface of a substrate by treating the surface of a substrate 10 having an inorganic oxide film on the surface with the silane coupling agent, (2) a first catalyzing step of allowing the silane coupling agent to capture a catalyst metal 14 by bringing a solution containing the catalyst metal into contact with the surface of the substrate, (3) a second catalyzing step of depositing palladium 16 on a part of the surface of the substrate with any silane coupling agent not coupled therewith by bringing a tin chloride solution and a palladium chloride solution or tin/palladium colloid solution into contact with the surface of the substrate, and (4) an electroless plating step of depositing an electroless copper plating film 18 on the surface of the substrate by performing the electroless copper plating by using the copper plating solution containing nickel compound of a small amount. COPYRIGHT: (C)2007,JPO&INPIT
|
