发明名称 |
Integrated circuit chip and integrated device |
摘要 |
Embodiments provide for integrated circuit chip and device having such an integrated circuit, in which different types of pads are arranged in separate rows. In one embodiment the pads are intelligently arranged to reduce the loop inductance of corresponding signal and power supply bond wires.
|
申请公布号 |
US2007023898(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
US20050192663 |
申请日期 |
2005.07.29 |
申请人 |
GOSPODINOVA MINKA;THOMAS JOCHEN;SAVIGNAC DOMINIQUE |
发明人 |
GOSPODINOVA MINKA;THOMAS JOCHEN;SAVIGNAC DOMINIQUE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|