发明名称 |
METHOD OF TESTING A SEMICONDUCTOR CHIP AND JIG USED IN THE METHOD |
摘要 |
A method of and testing jig for sequentially testing front and rear surfaces of a semiconductor chip is shown. The testing jig includes a support package having a first cavity over which the semiconductor chip mounts; an infrared filter affixed relative to the first cavity and attached to a rear surface of the semiconductor chip; and a test substrate having a second cavity exposing the infrared filter and upon which the support package mounts. Front and rear surfaces of the semiconductor chip can be conveniently and sequentially tested. Because the testing jig includes the infrared filter and the heat pad, heat can be easily transmitted to the detective chip.
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申请公布号 |
US2007023610(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
US20060420205 |
申请日期 |
2006.05.24 |
申请人 |
KIM DAE-JONG;CHOI HO-JEONG;PARK CHAN-SOON |
发明人 |
KIM DAE-JONG;CHOI HO-JEONG;PARK CHAN-SOON |
分类号 |
G01C21/24 |
主分类号 |
G01C21/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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