| 摘要 |
A method and system for housing electronic components includes a chassis having a first sub-chassis slidably dockable into a first end of the chassis. The first sub-chassis houses a first set of electronic components and includes a backplane to electrically couple the first set of electronic components to a second set of electronic components located adjacent to the first sub-chassis. The second set of electronic components is housed in a second sub-chassis, which is accessible via a second end of the chassis. The backplane is accessible by slidably undocking the first sub-chassis without removal of any one of the second set of electronic components. Some of the second set of electronic components are accessible by slidably undocking the first sub-chassis and without removal of the backplane.
|
