| 摘要 |
An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.
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