发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>Disclosed is a photosensitive resin composition which can achieve both of the prevention of the production of whitish turbidity on the film surface and the prevention of the reduction in residual film thickness. A photosensitive resin composition comprising an alkali-soluble resin, a sensitizer having a quinonediazide group and a curing agent, the alkali-soluble resin being an acrylic resin, the curing agent having an epoxy group, and the resin composition further containing a polycarboxylic acid ester compound which has a melting point of 20°C or lower and in which a part of plural carboxyl groups being esterified with a higher alcohol; and a flat display panel or semiconductor device having a planarized film or an interlayer insulation film formed by using the photosensitive resin composition. The polycarboxylic acid ester compound is preferably formed from an aliphatic unsaturated dicarboxylic acid.</p>
申请公布号 WO2007013459(A1) 申请公布日期 2007.02.01
申请号 WO2006JP314680 申请日期 2006.07.25
申请人 AZ ELECTRONIC MATERIALS (JAPAN) K.K.;KURIHARA, SEIJI;OGATA, TOMONARI;TAKAHASHI, SHUICHI;ZHANG, YONG 发明人 KURIHARA, SEIJI;OGATA, TOMONARI;TAKAHASHI, SHUICHI;ZHANG, YONG
分类号 G03F7/004;G03F7/022 主分类号 G03F7/004
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