<p>Disclosed is a photosensitive resin composition which can achieve both of the prevention of the production of whitish turbidity on the film surface and the prevention of the reduction in residual film thickness. A photosensitive resin composition comprising an alkali-soluble resin, a sensitizer having a quinonediazide group and a curing agent, the alkali-soluble resin being an acrylic resin, the curing agent having an epoxy group, and the resin composition further containing a polycarboxylic acid ester compound which has a melting point of 20°C or lower and in which a part of plural carboxyl groups being esterified with a higher alcohol; and a flat display panel or semiconductor device having a planarized film or an interlayer insulation film formed by using the photosensitive resin composition. The polycarboxylic acid ester compound is preferably formed from an aliphatic unsaturated dicarboxylic acid.</p>
申请公布号
WO2007013459(A1)
申请公布日期
2007.02.01
申请号
WO2006JP314680
申请日期
2006.07.25
申请人
AZ ELECTRONIC MATERIALS (JAPAN) K.K.;KURIHARA, SEIJI;OGATA, TOMONARI;TAKAHASHI, SHUICHI;ZHANG, YONG