| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photodetection system having features, such as radiation resistance properties, and to provide a module. <P>SOLUTION: One photodetection system includes a wide band gap photodetector array 12. The photodetector array is integrated onto a flexible interconnection layer 18 having an electric connection section 20 physically and electrically, is packaged while the photodetector array is integrated to an electronic device 14 for processing electrically so that the electronic device for packaging and processing obtains a signal detected by the photodetector array for processing, or includes both the flexible interconnection layer and the feature section of the electronic device packaging for processing. <P>COPYRIGHT: (C)2007,JPO&INPIT |
