| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely prevent thermal damages to a component to be mounted on a substrate and to the substrate itself while making the entire apparatus compact, in component mounting wherein a series of processes are conducted on a plurality of substrates one by one and components are mounted on the individual substrate sequentially. <P>SOLUTION: The substrates equipped with components via a bonding material are located first at a heat treatment position A2. Then at a cooling treatment position A3, and then at an after-treatment position A4 one by one to conduct a series of processes on the plurality of substrates sequentially to mount the components on the substrates sequentially. In this component mounting, the existence of a first substrate 1-1 at either the cooling treatment position A3 or at the post-treatment position A4 and at the heat treatment position A2 is detected. When it is found that the first substrate 1-1 is not located at either the cooling processing position A3 or at the post-treatment position A4, and at the heat treatment position A2 based on the detection results; the arrangement of a second substrate 1-2 is permitted at the heat treatment position A2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
