| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer board along with its manufacturing method and a power semiconductor module, which incorporates a coolant path for high cooling performance. <P>SOLUTION: The ceramic multilayer board S of a plurality of stacked ceramic layers with a power semiconductor device 6 mounted thereon comprises a coolant path 2 which is arranged inside a ceramic multilayer board body 1 for communication of coolant (a), and a via hole conductor 3 which thermally connects the coolant path 2 with the power semiconductor device 6 (b). In manufacturing the power semiconductor device, a sintering-resistant member is arranged inside a non-sintered ceramic laminate. A non-sintered composite laminate is formed in which a via hole conductor extending is arranged from the surface of the non-sintered ceramic laminate to the sintering-resistant member which is sintered at such temperature as no sintering-resistant member is substantially sintered. Then the sintering-resistant member is removed from the sintered composite laminate to form a coolant path, with a part of the via hole conductor exposed from the coolant path. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
