| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is manufactured by reducing the number of manufacturing steps as well as material cost, and also to provide its manufacturing method. <P>SOLUTION: A thermoplastic resin 21 which expresses adhesivity by heating and softening is provided on the surface of an insulating substrate 20 having heat resistance, and a conductor pattern 25 is formed on the surface of the thermoplastic resin. At the same time, the chip connection terminal 25a of the conductor pattern is buried in the thermoplastic resin 21 and it is depressed onto the insulating substrate 20, and then a chip electrode is connected to the chip connection terminal 25a by means of a metal bump 33. While the lower part is being buried in the thermoplastic resin 21, a semiconductor chip 32 is mounted to the insulating substrate 20, and it is mounted to a flexible printed wiring board 27. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
