| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a mask for obtaining flatness of a mask as predicted by an actual exposure apparatus, and to provide a method for measuring flatness of a mask, a pellicle mounting device and a method for manufacturing a semiconductor device. <P>SOLUTION: The method for manufacturing a mask includes a step of mounting a pellicle on an exposure mask, wherein in the step (S110) of mounting the pellicle, a first humidity in the environment where the pellicle is exposed is controlled to be lower than a second humidity in the environment where an exposure mask mounting the pellicle is exposed in a predetermined exposure apparatus. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
