| 摘要 |
PROBLEM TO BE SOLVED: To ease handling of a wafer that is made thinner by grinding in the following processing or transportation, and to make it possible to divide the wafer into devices. SOLUTION: The surface side of a wafer W wherein a device area and a peripheral excessive area surrounding the device area are formed on the surface is held by a holding table 20 of a grinder 2, an area corresponding to the device area in the rear surface of the wafer W is ground to form a concave W3, and an annular enforced part W4 is formed on the peripheral side of the convex W3. After a protection tape is stuck to the concave W3, the wafer is divided into devices while the protection tape side is being held by a chuck table of a dividing device for dividing the wafer W. Even if the thickness of the device area is made very small, the device area is enforced from the periphery area W4, so that the wafer W after the rear surface is ground can be easily removed from the holding table of the grinder, and handling of the wafers can be eased during conveyance of the wafers in the following steps and among the following steps. COPYRIGHT: (C)2007,JPO&INPIT
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