发明名称 BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a board which can increase the positional accuracy of an electronic component fixed to the main body of the board and can make the board thin, and also to provide a method for manufacturing the board. SOLUTION: The board has a body 11, a recess 21 formed on the board body 11 and nearly corresponding in size to the outer shape of a capacitor component 13, the capacitor component 13 positioned on the recess 21, and notches 22 formed in the board body 11 forming side surfaces of the recess 21. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007027527(A) 申请公布日期 2007.02.01
申请号 JP20050209509 申请日期 2005.07.20
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOBAYASHI TOSHIO;ARAI SUNAO;MIYASHITA HITOSHI;IIZUKA HAJIME
分类号 H01L23/12;H01L25/00 主分类号 H01L23/12
代理机构 代理人
主权项
地址