| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for testing magnetic sensor modules capable of reducing manufacturing costs of magnetic sensor modules. SOLUTION: A plurality of magnetic sensor module each comprising a magnetic sensor and a digital signal processing part are formed on a wafer. A probe card having a coil for impressing the magnetic sensor with a magnetic field is brought into contact with any magnetic sensor module. Without separating the probe card from the magnetic sensor module, test signals are inputted to the digital signal processing part via the probe card. By acquiring response signals of the digital signal processing part to the test signals via the probe card, the digital signal processing part is tested. By acquiring response signals of the magnetic sensor module via the probe card as supplying a current to the coil, the magnetic sensor is tested. COPYRIGHT: (C)2007,JPO&INPIT
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