| 摘要 |
A method of making a stacked die package ( 50 ) includes attaching and electrically connecting a first integrated circuit (IC) die ( 52 ) to a base carrier ( 56 ). A plurality of successive layers ( 54 A, 54 B and 54 C) of an adhesive material ( 54 ) is formed on the first die ( 52 ). A second die ( 72 ) is attached to the first die ( 52 ) with the adhesive material ( 54 ) such that the successive layers of adhesive material ( 54 A, 54 B and 54 C) maintain a predetermined spacing (H) between the first die ( 52 ) and the second die ( 72 ). The second die ( 72 ) is electrically connected to the base carrier ( 56 ).
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