发明名称 |
Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal |
摘要 |
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 mum on top of a support, comprising (A) a compound that generates acid on irradiation with active light or radiation, (B) a resin that displays increased alkali solubility under the action of acid, and (C) an alkali-soluble resin, wherein the component (B) comprises a resin formed from a copolymer containing a structural unit (b1) with a specific structure.
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申请公布号 |
US7169532(B2) |
申请公布日期 |
2007.01.30 |
申请号 |
US20040025589 |
申请日期 |
2004.12.29 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
OKUI TOSHIKI;MISUMI KOICHI;SAITO KOJI |
分类号 |
G03F7/004;B32B17/10;G11B5/64 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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