发明名称 |
System and method for hermetic seal formation |
摘要 |
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.
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申请公布号 |
US7168608(B2) |
申请公布日期 |
2007.01.30 |
申请号 |
US20020327870 |
申请日期 |
2002.12.24 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
MEI ZEQUN |
分类号 |
B23K1/14;B23K31/02;B23K35/00;B23K35/02;B23K35/14;B23K35/26;B23K35/30;C22C11/06;C22C12/00;C22C28/00 |
主分类号 |
B23K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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