发明名称 MOLD TEMPERATURE ADJUSTING APPARATUS AND METHOD OF THE SAME
摘要 <p>A mold temperature adjusting apparatus (1) is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold (2) being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained. The mold temperature adjusting apparatus comprises a high temperature fluid tank (4) and a low temperature fluid tank (3), a high temperature fluid supply system (41) and a high temperature fluid return system (42) between the mold and the high temperature fluid tank (4), a low temperature fluid supply system (31) and a low temperature fluid return system (35) between the mold (2) and the low temperature fluid tank (3), a high temperature fluid by-pass system (43) and a low temperature fluid by-pass system (40), a heat recovery tank (5) connected to the high temperature fluid tank (4) and a pressure adjusting means (37). <IMAGE></p>
申请公布号 KR100676566(B1) 申请公布日期 2007.01.30
申请号 KR20060093164 申请日期 2006.09.25
申请人 发明人
分类号 B29C45/73;B29C45/78;B29C33/04;B29C35/00;B29C45/76;G05D23/02 主分类号 B29C45/73
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