发明名称 |
Process for sawing substrate strip |
摘要 |
A process for sawing a substrate strip marks corresponding to substrate areas of substrate strips which are arranged side-by-side on a plate. A saw machine is mechanically moved to the substrate areas and positioned by the alignment marks of corresponding substrate areas for cutting the substrate areas of the substrate strips in the first phase. Then the saw machine is further mechanically moved to the substrate areas again and is positioned by the alignment marks of corresponding substrate areas again for cutting the substrate areas of the substrate strips in the second phase. Therefore, an error in any of the substrate areas in the first phase and second phase will not accumulate to the subsequent substrate areas in the substrate strip.
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申请公布号 |
US7168352(B2) |
申请公布日期 |
2007.01.30 |
申请号 |
US19990394918 |
申请日期 |
1999.09.13 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
SU JAU-YUEN;CHEN TAO-YU;TAO SU |
分类号 |
B26D1/00;B23D59/00;H01L21/00 |
主分类号 |
B26D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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