发明名称 Material architecture for the fabrication of low temperature transistor
摘要 A structure and method for forming a carbon-containing layer in at least a portion of the end of range regions of implanted PAI and/or doped regions. The C-containing layer/region getters defects from the implanted PAI region or doped region. Example embodiments show a C-containing layer under at FET. Other example embodiments show an implanted C-containing regions implanted into the EOR region of implanted doped regions, such as pocket regions, S/D regions and SDE regions. Low temperature anneals can be used because the carbon-containing layer reduces defects.
申请公布号 US7169675(B2) 申请公布日期 2007.01.30
申请号 US20040886442 申请日期 2004.07.07
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING, LTD 发明人 TAN CHUNG FOONG;LIU JINPING;LEE HYEOKJAE;TEE KHENG CHOK;QUEK ELGIN
分类号 H01L21/336 主分类号 H01L21/336
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