发明名称 |
Method of characterization, method of characterizing a process operation, and device manufacturing method |
摘要 |
A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. In one embodiment, the distortion in the substrate wafer is measured after each exposure and processing operation by comparing the position of a plurality of reference marks to values in a database.
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申请公布号 |
SG128581(A1) |
申请公布日期 |
2007.01.30 |
申请号 |
SG20060003843 |
申请日期 |
2006.06.06 |
申请人 |
ASML NETHERLANDS B.V. |
发明人 |
MOL DE CHRISTIANUS GERARDUS MARIA |
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