Method and device for cleaning and then bonding substrates

摘要

The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dried, aligned and directly bonded under micro-clean room conditions. The bonding process is preferably visually monitored during bonding in order to immediately remove insufficiently bonded substrates from the process. The inventive device is compact and allows integration of the process steps in a single installation without disruption. The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding process. It also allows the use of novel bonding processes.