发明名称 |
Flexible substrate and method of manufacture |
摘要 |
A flexible substrate for a flexible circuit provided by a substrate having a thickness in the range of 25 microns to 60 microns including at least one zone where the thickness of said substrate is reduced to less than 25 microns. The reduced thickness zone may be defined by laser skiving.
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申请公布号 |
SG128505(A1) |
申请公布日期 |
2007.01.30 |
申请号 |
SG20050004032 |
申请日期 |
2005.06.22 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
TRUONG THACH GIOI;LEE YONG PENG |
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