发明名称 |
Semiconductor wiring substrate, semiconductor device, method for testing semiconductor device, and method for mounting semiconductor device |
摘要 |
An apparatus for testing a semiconductor device by mounting a plurality of chip intellectual properties (IPs) on a common semiconductor wiring substrate, including a silicon wiring substrate on which the chip IPs are mounted. A circuit for a boundary scan test is formed on the silicon wiring substrate by connecting flip-flops to wiring, which are arranged to test connections in the wiring. An IP on Super-Sub (IPOS) device or each chip IP may be arranged to facilitate a scan test, a built-in self-test (BIST), etc., on the internal circuit of the chip IP.
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申请公布号 |
US7171600(B2) |
申请公布日期 |
2007.01.30 |
申请号 |
US20040828263 |
申请日期 |
2004.04.21 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKEOKA SADAMI;OHTA MITSUYASU;ICHIKAWA OSAMU;YOSHIMURA MASAYOSHI |
分类号 |
G01R31/28;G01R31/317;G01R31/3183;G01R31/3185;G06F11/22;G11C5/02;G11C29/48 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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