| 摘要 |
A mulitlayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer 1 has a first multilayer circuit pattern 2 electrically connected through via holes 3. A second ceramic layer 2 also has a second multilayer circuit pattern 2 electrically connected through via holes 3. A thermosetting resin sheet 17 is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer. |
