发明名称 Silicon wafer maintaining system for wafer probing machine, has removable plate for receiving wafer, and support element receiving removable plate, where external diameter of plate is greater than diameter of wafer
摘要 #CMT# #/CMT# The system has a support comprising a fixation element for fixing a support element to interior of a loading slide of a wafer probing machine. A removable plate receives a wafer, and the support element receives the removable plate. The plate has an edge (120) for positioning and maintaining the wafer in position. The plate is in the shape of disk or ring and adapted to the shape of the wafer, where the external diameter of the plate is greater than the diameter of the wafer. #CMT# : #/CMT# Independent claims are also included for the following: (1) a manual loading slide for a probing machine (2) a silicon wafer probing machine comprising a loading slide. #CMT#USE : #/CMT# Used for maintaining a silicon wafer in a manual loading slide of a wafer probing machine (claimed), where the wafer is utilized for making an electronic chip for an integrated circuit. #CMT#ADVANTAGE : #/CMT# The removable plate receives the wafer, so that the displacement of the plate permits to displace the wafer without requiring direct handling with hand, thus avoiding all the risks of breakage and damage to the wafer. The external diameter of the plate is greater than the diameter of the wafer, so that the wafer does not rise above from the plate. The system is light weight and permits to prevent the displacement of the wafer in a plane parallel to the plate. The plate is rigid, does not deform under the weight of the wafer and under the effect of variation of temperature. The edge of plate positions and maintains the wafers of two different diameters such as wafer of six inches of diameter and wafer of eight inches of diameter. The plate is thin and made up of aluminum so that the encumbrance and weight of the plate is limited. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional view of a silicon wafer maintaining system. 120 : Edge 121a : Upper part 121b : Lower part 122 : Flat zone 123 : gap #CMT#METALLURGY : #/CMT# The plate is made of aluminum.
申请公布号 FR2888987(A1) 申请公布日期 2007.01.26
申请号 FR20050007691 申请日期 2005.07.20
申请人 STMICROELECTRONICS SA SOCIETE ANONYME 发明人 GOEURIOT BENOIT;CHESSEL PHILIPPE
分类号 H01L21/683;H01L21/66 主分类号 H01L21/683
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