| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which cracks on an external electrode can be prevented, and to provide a manufacturing method thereof, a circuit board and electronic equipment. SOLUTION: The semiconductor device has an insulation film 14 having a through hole 14a formed thereon; a semiconductor chip 12 having an electrode 13; a wiring pattern 18 pasted on a region including the top of the through hole 14a on one surface of the insulation film 14 via an adhesive 17, and electrically connected to the electrode 13 of the semiconductor chip 12; and the external electrode 16 provided on the wiring pattern 18 via the through hole 14a and projecting from a surface opposite to that of the wiring pattern 18. One part of the adhesive 17 is drawn between the through hole 14a and the external electrode 16 and interposes. COPYRIGHT: (C)2007,JPO&INPIT |
