HEAD MODULE, LIQUID EJECTING HEAD, LIQUID EJECTOR, AND MANUFACTURING METHOD FOR HEAD MODULE

摘要

PROBLEM TO BE SOLVED: To prevent an outflow of a sealing material at a connecting part, an exposure part and the like of a wiring board by a simple constitution. SOLUTION: A nozzle sheet 25 is arranged to have nozzles positioned within a head chip stationing hole of a module frame 11 and to cover a part of the region of the head chip stationing hole. A head chip 20 has a pair of groove parts 24a formed in a barrier layer 24. Each head chip 20 is arranged at each head chip stationing hole so that a heating resistor 22 and the nozzle are opposed to each other and each groove part 24a is disposed on the nozzle sheet 25 at a position where the nozzles are not formed. A flexible wiring board 3 is arranged so that its electrode and an electrode of the head chip 20 are electrically connected to each other. A gap between the head chip 20 of the side where the flexible wiring board 3 is set and the module frame 11 is sealed by the sealing material 29. COPYRIGHT: (C)2007,JPO&INPIT