| 发明名称 |
Method for whole field thin film stress evaluation |
| 摘要 |
A novel method for whole field thin film stress evaluation is provided. Through the provided method, the whole filed thin film stress distribution for an optical thin film would be developed with a commercial interferometer, so that a whole field evaluation for the crack or peel-off of thin film is hence achievable.
|
| 申请公布号 |
US2007017296(A1) |
申请公布日期 |
2007.01.25 |
| 申请号 |
US20060430449 |
申请日期 |
2006.05.09 |
| 申请人 |
INSTRUMENT TECHNOLOGY RESEARCH CENTER, NATIONAL APPLIED RESEARCH LABORATORIES |
发明人 |
HUANG CHI H.;YOU HSIEN-I;SHIH MAO-YUAN;CHEN CHIEN-JEN |
| 分类号 |
G01L1/24 |
主分类号 |
G01L1/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
