THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM, LEAD FRAME OR SEMICONDUCTOR DEVICE COMPIRISNG THE SAME, AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE SAME

摘要

Disclosed are: an adhesive film for use in a semiconductor, which enables the firm adhesion of a lead frame to a semiconductor chip at a lower gluing temperature than that for a conventional adhesive film comprising a polyimide resin without causing the void formation, and which can be used for the protection of the exposed surface of a lead frame; a thermoplastic resin composition for use in a semiconductor, which serves as an adhesive layer in the adhesive film; and a lead frame or semiconductor device having the adhesive film provided therein. A thermoplastic resin composition for use in a semiconductor, comprising a thermoplastic resin produced by reacting an amine component which comprises an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3'-(3''-aminophenoxy)phenyl)amino-1-(3'-(3''- aminophenoxy)phenoxy)benzene and 3,3'-bis(3''- aminophenoxy)diphenylether with an acid component (C); an adhesive film for use in a semiconductor comprising the thermoplastic resin composition; and a lead frame or semiconductor device having the adhesive film provided therein.