| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in mountability, and a manufacturing method thereof. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 10 having a plurality of electrodes 14; a resin projection 20 formed on the semiconductor substrate 10; and a wiring 30 electrically connected to the electrodes 14, and formed so as to reach onto the resin projection 20. Concave portions 25 are formed on an upper end surface 22 of the resin projection 20. Notches 32 overlapping with at least one part of the concave portions 25 are formed on the wiring 30. <P>COPYRIGHT: (C)2007,JPO&INPIT |
