| 摘要 |
<P>PROBLEM TO BE SOLVED: To attempt miniaturization of a package by helping a chip to operate stably through minimizing noise generation where a bonding wire is run through that connects between a substrate and the chip, reducing the size of the substrate, and decreasing the number of components to be mounted thereupon. <P>SOLUTION: The present invention provides a semiconductor multi-chip package that includes a substrate, a first semiconductor chip mounted on the top surface of the substrate, at least a second semiconductor chip arranged directly onto the first semiconductor chip, and a spacer arranged between the substrate and the second semiconductor chip such that the second semiconductor chip is electrically connected to the substrate while keeping the top-bottom distance between the first semiconductor chip and the second semiconductor chip. <P>COPYRIGHT: (C)2007,JPO&INPIT |
