发明名称 FUNCTIONAL FILM-CONTAINING STRUCTURE AND MANUFACTURING METHOD OF FUNCTIONAL FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a functional film capable of easily peeling the functional film formed on a film forming substrate from the film forming substrate. <P>SOLUTION: The manufacturing method of the functional film comprises a process (a) for forming an electromagnetic wave absorbing layer on a substrate using a material which generates heat by the absorption of an electromagnetic wave, a process (b) for forming a separation layer on the electromagnetic wave absorbing layer using an inorganic material which is decomposed by heating to produce a gas, a process (c) for forming a layer to be peeled, which is formed using a functional material and contains the functional film, on the separation layer, and a process (d) for peeling the layer to be peeled from the substrate by irradiating the electromagnetic wave absorbing layer with an electromagnetic wave or for lowering the joining strength of the layer to be peeled and the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007015377(A) 申请公布日期 2007.01.25
申请号 JP20060157720 申请日期 2006.06.06
申请人 FUJIFILM HOLDINGS CORP 发明人 SAKASHITA YUKIO
分类号 B32B7/06;B32B9/00;H01L37/02;H01L39/24;H01L41/18;H01L41/187;H01L41/313;H01L41/332;H01L41/39 主分类号 B32B7/06
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