POLYIMIDE AND/OR POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE RESIN FILM PREPARED BY USING THE SAME, POLYIMIDE RESIN-COATED BODY AND ELECTROCONDUCTIVE MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a polyimide and/or a polyimide precursor composition generating no time-dependent gelation and viscosity reduction even when an electroconductive polyaniline is highly dispersed in the polyimide and/or the polyimide precursor composition and excellent in preservation stability. SOLUTION: The polyimide and/or the polyimide precursor composition contains the electroconductive polyaniline and the polyimide and/or the polyimide precursor and the ratio of a free nonbonded acid dopant over the electroconductive polyaniline is≤0.2 molar ratio per single unit of the polyaniline. Polyimide resin films, polyimide resin coated bodies and the electroconductive members are produced by using the same. COPYRIGHT: (C)2007,JPO&INPIT