| 摘要 |
A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed with a set of ribs corresponding to the set of grooves and extending into and affixed to the set of grooves. Glue or adhesive material, such as silicone or silicone o-rings, may be provided between the set of ribs and the set of grooves to secure the backplate to the heatsink. A second set of ribs extending from the heatsink may also be included, such that space is allowed between each rib of the second set of ribs and the backplate. An epoxy-adhesive material may be disposed between the second set of ribs and the backplate, or the second set of ribs may be welded or partially welded. Also provided are the backplate and a method of manufacture.
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