Sensors and transponders combined on a single semiconductor substrate package. The invention includes an RFID tag and a sensor commonly assembled onto a common substrate. The substrates can be provided in the form of a flex circuit or printed circuit board. The flex circuit would be fabricated using standard flex circuit fabrication methods. It is a polymer/metal laminate film structure and incorporates the antenna pattern for the sensor and RFID tag system on the circuit. The flex circuit can also combine antennas for the sensor and the RFID tag onto a single flex circuit substrate, thus eliminating the need for separate antennas.
申请公布号
WO2007011377(A2)
申请公布日期
2007.01.25
申请号
WO2005US32879
申请日期
2005.09.14
申请人
HONEYWELL INTERNATIONAL INC.;COOK, JAMES, D.;DALE, RICHARD, L.