发明名称 |
POLYAMIDE RESIN, EPOXY RESIN COMPOSITIONS, AND CURED ARTICLES THEREOF |
摘要 |
An aromatic polyamide resin having phenolic hydroxyl groups as represented by the general formula (1): (1) [wherein m and n in terms of averages satisfy the relationship: 0.005 < n/(m+n) < 0.05 and the sum of m and n is a positive number of 2 to 200; Ar<SUB>1</SUB> is a divalent aromatic group; Ar<SUB>2</SUB> is a divalent aromatic group having a phenolic hydroxyl group; and Ar<SUB>3</SUB> is a divalent aromatic group]; and resin compositions (such as epoxy resin compositions) containing the polyamide resin. The polyamide resin little contains ionic impurities and is improved in adhesiveness without adversely affecting the excellent characteristics inherent in conventional aromatic polyamide resins having phenolic hydroxyl groups, e.g., the excellent flexibility, electrical characteristics, and flame retardance of cured articles of epoxy resin compositions containing the polyamide resins. |
申请公布号 |
WO2007010932(A1) |
申请公布日期 |
2007.01.25 |
申请号 |
WO2006JP314254 |
申请日期 |
2006.07.19 |
申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA;ISHIKAWA, KAZUNORI;UCHIDA, MAKOTO;AKATSUKA, YASUMASA |
发明人 |
ISHIKAWA, KAZUNORI;UCHIDA, MAKOTO;AKATSUKA, YASUMASA |
分类号 |
C08G69/32;B32B15/08;B32B15/092;C08G59/62;C08L77/10;H05K1/03 |
主分类号 |
C08G69/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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