发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>A method of manufacturing a semiconductor device having a polycrystalline silicon layer (5) includes; a step of forming a mask layer (7) on the polycrystalline silicon layer (5); a step of forming a side wall (8) that is provided on a side face of the mask layer (7) and covers part of the polycrystalline silicon layer (6); a step of doping an impurity (52) into the polycrystalline silicon layer (5) by using at least one of the mask layer (7) and the side wall (8) as a mask; and a step of etching the polycrystalline silicon layer (5, 6) by using at least one of the mask layer (7) and the side wall (8) as a mask.</p>
申请公布号 WO2007010732(A1) 申请公布日期 2007.01.25
申请号 WO2006JP313164 申请日期 2006.06.26
申请人 NISSAN MOTOR CO., LTD.;YAMAGAMI, SHIGEHARU;HOSHI, MASAKATSU;HAYASHI, TETSUYA;TANAKA, HIDEAKI;SHIMOIDA, YOSHIO 发明人 YAMAGAMI, SHIGEHARU;HOSHI, MASAKATSU;HAYASHI, TETSUYA;TANAKA, HIDEAKI;SHIMOIDA, YOSHIO
分类号 H01L21/18;H01L29/24;H01L29/267;H01L29/78 主分类号 H01L21/18
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